Advanced Performance With Aluminum Nitride Substrate Technology

Aluminum Nitride PCBs boast exceptional mechanical strength and durability, which enable them to withstand the rigorous demands of advanced electronic applications and ensure long-term reliability.

AlN substrates boasting high thermal conductivity, electrical insulation, low coefficient of thermal expansion and superior mechanical strength are ideal for power electronics such as converters and inverters used in renewable energy systems and electric vehicle power systems.

High Thermal Conductivity

Aluminium nitride substrate technology has seen remarkable market expansion thanks to technological advancements and the rising demand for high-performance electronics, creating opportunities in its use as PCB materials. Aluminum nitride structures offer both mechanical strength and thermal conductivity that outshone other PCB materials.

AlN substrates boast outstanding insulation properties, making them the ideal material for submersion components. Their coefficient of thermal expansion resembles that of silicon (Si), making these substrates highly heat cyclable while increasing reliability of devices that use them.

Our substrates’ resistance to corrosion and harsh environments is also driving industry adoption. Their non-toxic nature makes them an attractive option for implantable electronic devices in operating theatres where performance and durability are critical, compatible with various medical grade fluids, while their superior mechanical strength and chemical stability also make them suitable for automotive applications – they can withstand abrasion, vibration or high temperature cycling without damaging electrical circuitry and increasing device lifespan and decreasing downtime for maintenance costs.

Excellent Electrical Insulation

Aluminum Nitride (AIN) substrates offer excellent comprehensive properties that make them an excellent choice for high performance electronics and semiconductor industry applications, including high thermal conductivity (range: 170-230W/mK), electrical insulation and an expansion coefficient that’s compatible with silicon. All these characteristics make AIN ceramics the ideal material choice.

AlN is often utilized as a nontoxic alternative to Beryllium Oxide (beO) for PCB manufacturing due to its superior thermal shock, corrosion and oxidation resistance at high temperatures, along with excellent mechanical strength for use in complex shapes.

Aluminum Nitride Substrate Market Analysis | Key Drivers and Challenges The aluminum nitride substrate market is driven by various key drivers and challenges, with advances in production techniques, expansion into electric vehicles, integration with 5G technologies all contributing to its continued expansion. A focus on sustainability also influences market dynamics with manufacturers adopting eco-friendly production methods while improving recycling processes to meet regulatory requirements while appealing to environmentally aware consumers who help drive further market expansion.

Low Thermal Expansion

As more complex and powerful electronic devices are designed, their production of heat increases significantly and must be dissipated efficiently – this is where aluminium nitride substrates come into play.

These materials offer superior thermal conductivity, enabling the dissipation of excess heat and prolonging electronic applications’ lifespans. Furthermore, these materials have electrical insulation properties and an expansion coefficient that closely mirrors that of silicon, making them suitable for many high-temperature applications.

HM produces aluminium nitride ceramic substrates in their green or biscuit state, which can be easily machined into different shapes and sizes before being fired at high temperatures to sinter and densify them – producing products with comparable flexural strength to that of Al2O3. They can be supplied in standard dimensions or custom-made products can be made to meet customer requirements; their aluminium nitride ceramic substrates are suitable for high performance electronic applications including power modules, LED lighting and laser diodes.

High Flexural Strength

HM’s Alunit(r) AlN HP substrate boasts impressive mechanical strength to meet the rigorous demands of power modules and other high-performance applications, such as Vickers hardness of up to 950. With such remarkable properties as its impressive flexural strength of up to 450 MPa and tight electrical and thermal tolerances demanded by modern semiconductor technology.

With superior chemical resistance and dielectric constant properties, this substrate is the ideal choice for heat dissipating substrates in electronic devices such as LEDs, power modules and wafer bonding applications. Furthermore, its outstanding corrosion resistance enables it to resist most chemicals used in electronic manufacturing including inorganic acids, strong alkalis and even molten metal.

Aluminum nitride substrates are experiencing rapid expansion across various high-performance applications, driven by technological advancements, increasing demands in high-power electronics, optoelectronics expansion and 5G technologies integration. A focus on sustainability has also impacted industry expansion; manufacturers adopt eco-friendly production methods while improving recycling processes to minimize environmental impact.