High Performance Electronics With Aluminum Nitride Substrates
Aluminum nitride substrates are indispensable components in high-tech electronics applications, including power electronics, telecom equipment, LED lighting and automotive electronics. Industries relying on them include power electronics, telecom, LED lighting and automotive to effectively dissipate heat.
Ceramtec’s Alunit(r) AlN HP offers superior flexural strength combined with exceptional thermal conductivity, making it ideal for electric vehicle power electronics applications. Furthermore, its coefficient of thermal expansion matches that of typical semiconductor materials ensuring long-term durability of power modules.
High Thermal Conductivity
Aluminum nitride is a technical ceramic with unique properties. Aluminum nitride stands out as having high thermal conductivity, making it perfect for use in electronic devices and systems.
Heat dissipation is vital to ensure power electronics components such as transistors and diodes continue to perform optimally for years to come, without overheating and becoming unsafe to use.
Ceramic substrates with exceptional thermal conductivity such as AlN, BN-AlN composites and beO are often preferred for high performance applications due to their superior thermal conductivity compared to traditional substrate materials. Their superior thermal conductivity facilitates better heat management.
Demand for high-performance electronic components has seen explosive growth across industries, driven by technologies like 5G infrastructure and electric vehicles. To meet this new demand, manufacturers require substrates with exceptional thermal conductivity and electrical insulation properties – with aluminum nitride being an efficient and effective way to manage heat in these high-performance applications.
High Electrical Insulation
Aluminum nitride is an exceptional electrical insulator with a lower dielectric constant than silicon and resistance to plasma erosion, making it suitable for use in power semiconductor devices such as MOSFETs and IGBTs.
Aluminum nitride substrates offer unsurpassed heat management capabilities to enable these electronic devices to perform reliably under extreme conditions. Their superior thermal conductivity enables these electronic devices to continue functioning reliably under extreme conditions, protecting functionality and increasing lifespan.
HM Ceramics produces ceramic substrates in their green or biscuit state, which can then be machined into various shapes and sizes before being fired at high temperatures to sinter and densify them. This process produces products with three-point bending strength comparable to alumina as well as coefficient of expansion that closely mirrors chip materials.
Good Mechanical Strength
Aluminum nitride boasts excellent mechanical strength that makes it suitable for PCB production, withstanding both mechanical stress and thermal cycling without succumbing to fatigue. Furthermore, its chemical stability guarantees it can withstand use in harsh environments.
AlN ceramic substrates have become an indispensable element in hybrid, power and microwave electronics applications ranging from solid relays and multi-chip packages (MCM) to power LEDs. Their combination of thermal conductivity and electrical insulation make them the ideal choice for use as heat dissipation substrates or to soak components.
Durability of these materials also ensures they can withstand abrasion and vibration, making them perfect for automotive applications where protecting circuitry from harsh conditions is of utmost importance. Their non-toxic nature also allows them to be safely used in medical devices that may come into contact with harsh chemicals; and their UV radiation resistance means they can resist degradation over time.
Excellent Compatibility
Aluminum nitride substrates boast impressive thermal, electrical, and mechanical properties that make them an excellent material choice for electronic devices of all kinds. Their excellent resistance to wear makes aluminum nitride an invaluable choice when producing advanced electronic components in industries where reliability is of the utmost importance.
They’re compatible with various manufacturing processes, making them an attractive option for various applications. Their compatibility can reduce production costs while facilitating easy integration into existing manufacturing processes – helping increase efficiency and overall productivity.
Aluminum nitride ceramic substrates are experiencing rapid global expansion, propelled by technological innovations and rising demand for high-power electronics and 5G telecom services. This growth represents an exceptional investment opportunity for investors seeking to capitalize on an expanding industry while meeting rising demand for high-performing devices in various applications.