Enhance Electronic Performance With an Aluminium Nitride Substrate
Aluminium Nitride substrate offer superior thermal conductivity and electrical insulation compared to standard PCBs made with fiberglass reinforced epoxy composites like FR-4. As such, they make them the ideal choice for heat dissipation in LED packages, power modules and other electronics applications.
AlN is a versatile material, easily machined in its green or biscuit forms; however, for densification to occur properly it requires precise sputter system control and precise densifying temperatures.
High Thermal Conductivity
Aluminum nitride stands out as one of the few materials capable of quickly dissipating heat, thanks to its high thermal conductivity and excellent electrical insulation properties; additionally, its coefficient of thermal expansion resembles that of silicon. To maintain optimal performance of electronic circuits, rapid heat dissipation must also occur efficiently; only materials with high thermal conductivity can achieve this task effectively. Aluminum nitride offers this capability and boasts electrical insulation properties similar to silicon.
Researchers have discovered that using a thick film paste containing copper oxide, it is possible to directly form a conductive path or layer on an AlN substrate. At the interface, an eutectic layer forms that interacts with the borosilicate glass component of the paste to form a strong bond that prevents leakage of current.
Accuratus provides both hot pressed and direct sintered aluminum nitride substrates for various applications. We can meet both standard size or custom fabrication requests; these substrates are compatible with mechanical dicing, laser scribing/cutting and thick film hybrid metallizing processes.
High Electrical Insulation
As electronic devices become more powerful, heat is generated that must be dissipated properly to avoid damage to connecting components and pose a fire risk.
Aluminum nitride boasts excellent electrical insulation and dielectric strength, making it the ideal material for protecting sensitive electronics from high temperatures. As such, aluminum nitride heat sinks and insulators are often utilized with this material.
Tape casting and sintering enable complex shape formation for fabrication of aluminum nitride ceramic trays used in semiconductor equipment, LED substrates, etching shields and plasma erosion environments. Aluminum nitride also offers resistance against erosion.
AlN boasts excellent thermal conductivity and electrical insulation properties that enable efficient wiring within devices, thus reducing loop inductance and increasing switching frequencies for greater switching frequency and switching frequency capabilities. Laser processing by HM can even accommodate specific drawings with hole sizes up to 0.05mm and thicknesses below 2mm for laser processing applications.
High Flexural Strength
Aluminium Nitride substrate stands out as an exceptionally robust ceramic material, boasting exceptional flexural strength. This allows devices designed with Aluminum Nitride to endure extreme abrasive conditions and high-temperature thermal cycling without suffering damage, while electrical systems use its heat dissipating capabilities quickly for maximum efficiency.
Wurtzite AlN is unique due to the strong ionic bonds found within it, its broken inversion symmetry along the polar direction, and non-centrosymmetric crystal structure, all which combine to allow spontaneous polarization at III-nitride semiconductor heterostructure interfaces without needing intentional doping.
BeO) due to its excellent thermal conductivity (170-230W/mK), electrical insulation properties and coefficient of expansion similar to silicon – makes it an essential substrate material for next-generation electronics, MEMS, optoelectronics, RF power devices and surface acoustic wave devices as well as LED packages. Ceramic trays and etching shields in semiconductor manufacturing equipment also commonly utilize this material as do LED package producers.
High Stability
Aluminum nitride is chemically stable in various environments and resistant to attacks from acids (with the exception of hydrofluoric acid [HF]), as well as high temperatures without degrading; making it an ideal material for electronics that operate under harsh environments.
Aluminum nitride provides excellent electrical insulation properties as well as superior thermal conductivity at elevated temperatures, making it suitable for a range of applications such as radio frequency/microwave circuitry. Customization capabilities exist so it can meet specific requirements, such as low thermal resistance and elevated thermal conductivity levels for use in such circuits.
Aluminum nitride comes in various states – green, biscuit and fully dense. It can easily be machined into complex geometries with ease; however, tolerances must be adjusted according to sintering process shrinkage of 20% which should be taken into consideration. With its superior mechanical strength and flexible surface properties, Aluminum Nitride makes an excellent material choice for LED packages, power modules or any electronic that requires rigid surfaces.
